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テープフレームカセットのメカニカルインタフェースのみが規定されている。すなわち，材料の種類や清浄性については定義しない。
XML is also used to structure information needed to route and deliver messages between applications
such as wafer carriers and wands
The purpose of this Document is to provide a guide for tris(dimethylamino) silane (3DMAS) for which a need has been identified
the array coordinate system may be referenced to the physical geometry of the wafer
T01600 - SEMI T16 - 極紫外線マスク自動識別用データマトリクス記号法適用の仕様 Revision:SEMI T16-0706 - Superseded テープフレームカセットのメカニカルインタフェースのみが規定されている。すなわち，材料の種類や清浄性については定義しない。Notice: This translation is a REFERENCE COPY ONLY. If differences should exist between the English version and a translation in any other language, the English version is the official and authoritative version. SEMI global Traceability Committee2006516global Audits and Reviews Subcommittee20066www. semi. org200511 EUV SEMI P37SEMI P386 6 Referenced SEMI Standards SEMI P37 Specification for Extreme Ultraviolet Lithography Mask Substrates SEMI P38
